Three-layer-PCBS

Three-layer PCBs:

• basic core material: FR4, thickness 1/1.5mm, 18/18 µm copper
• Third layer printed: as polymer CU cream copper, galvanically strenghtened to 10 µm.
• Third layer laminated: CU-foil 18/or 35/µm laminated on a two-layer core 1 mm thick.
• To prevent a bow-effect, the pcb is produced actually as a 4-layer board
• drilled according to the drilling data, drilled holes metallized
• solder mask photolithographically placed
• service print
• galvanic tin
• tinned with Cn100C solder /not recommended/ or
• treated by OSP or
• galvanic gold over galvanic nickel

Maximum size:

• 250 x 300mm when galvanic tinned
• 250 x 300mm when HAL tinned /solder mask needed
• 250 x 300mm OSP
• 250 x 300mm galvanic gold

Needed documents:

• GERBER data with check prints or
• positive films of tracks, solder masks and service print. Set of data files allways required for production purposes.
• EXCELLON drill data
• The boards are milled to final dimension only. Others must be consulted during placing the order.