6+Layer PCBS

STANDARD ASSEMBLY OF 6 AND MORE LAYERS BOARDS:

• Cores for the layers e.g. IN1+IN2 made of FR4, the same for IN3+IN4. The boards are etched, stacked together with prepregs and finished on both sides with copper foils 18/18 µm or 35/35 µm. The TOP and BOT layers are finally etched. We also have experience with the production of the boards with upto 26 layers.
• The geometry of the inner layers and resulting board thickness must be defined.
• To achieve proper impedancy of the circuit, copper to copper distances can be held in tolerance of 10 µm.
• Drilling according to the drilling data, drills metallized. Blind- or inside-vias can be ordered.
• Solder mask, photolitografically transfered
• Service print
• Tinned with Galvanic gilding HAL /not recommended/, or
• Galvanic gold over galvanic nickel, or
• treated with OSP
• More information under Multilayer boards

Maximum size:

• 380 x 400mm in galvanic tin
• 300 x 400mm solder mask and HAL /not recommended/
• 300 x 400mm galvanic gilded
• 300 x 400mm OSP

• GERBER data with control prints.Layer order must be clearly marked and described fom TOP to BOT in order not to be interchanged.
• Positive films with tracks, solder masks and service print. Set of data files allways required for production purpses.
• EXCELLON drill data. Blind- or inside-vias must be included in separate drill data files with the information of which layers it concerns.
• Final board size, eventual milling drawing. The final dimensions are finished only by milling. Other wishes have to be consulted during placing the order.
• All multilayer boards are tested: inner layers are optically tested, final boards are electrically tested. This testing is included in the board price.