4. Classification DPS to business groupsPCBs classified according to the intensity of production in two business groups. Basic version: The standard version in the basic plating Cu 35 micron should be formed wire electric motive power of at least 0.20 mm, the texts can be used 0.25 meters, solder pads should be increased by at least 0.60 mm from the specified diameter (img. 24) . Theme should not be less than 1.00 mm from the edge of DPS. Grooved edge should not intersect nor county copper surface, a thin wire should not be conducted only on an insulating distance from large areas of copper (Figure . # 2) . Insulating gap when loading a theme does not prescribe otherwise, should be at least 0.30 mm. Prescribed bore larger than 0.5 mm. design with high demands: basic criterion is to use a wire width and spacing below 0.2 mm, drilling prescribed under 0.5 mm, drowning and blind holes. This design increases the cost of PCB and is incorporated in our price list: PRICELIST |