8. Three-layer PCB
Standard three-layer printed circuit boards:
base layer material: FR4 thickness. 1.5 mm cladding 18/18 micron
Outer layer material: copper foil formed polymeric Cu screen printing pastes and the galvanic gain to 10 microns.
unless the customer specifically requested three layers design, manufacture these boards as a four-layer with the same two inner layers. If the board contains an odd number of layers, so the final product is very prone to bending or twisting.
board can also be made přilaminováním shielding layer using Cu foil force 18 or 35 micron same process as in the production of printed circuit boards čtyřvstvých.
- drilled by the drilling data as a via hole
- solder mask made fotoprocesem
- stripped galvanized tin
- gold plating
- tin solder Cn100C
- treated by OSP
Maximum size:
250 x 300 mm electroplating tin
250 x 300 mm solder mask HAL
300 x 400mm gold plating
250 x 400mm solder mask OSP
standard production bases:
data format GERBER with control or prints
positive film originals themes, solder masks and printing. I Delivery films require delivery of documents in a data form for calculation of process control.
drilling data format EXCELLON
enter dimensions DPS, drawing or milling. Other designs and assignments are subject to negotiation in order DPS. |
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